Flexible Electronics News

Evonik to Partner in HP Inc.’s Open Platform Program for New 3D Printing Materials

Will introduce new customized powder materials to the market for HP Multi Jet Fusion technology.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Evonik Industries will participate in HP Inc.’s Open Platform program and introduce new customized powder materials to the market for HP Multi Jet Fusion technology.   As a result of participation in HP’s Open Materials program, Evonik expects to see further development in additive manufacturing technologies in the direction of large-scale production of components, such as those used in the automotive and aircraft industries. Therefore, the Group intends to launch special powder materials for ...

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